Embedded antenna portfolio

Embedded Antennas:
Chip, PCB, FPC and Ceramic Patch

Embedded antennas for cellular, GPS/GNSS and IoT devices. Compare chip, PCB, FPC and ceramic patch formats, then match the antenna to the board, ground plane and enclosure.


GL-DY108 embedded cellular patch antenna
Ceramic GPS patch antenna for embedded GNSS designs

About the products

Embedded antennas designed around the host device

An internal antenna does not work in isolation. Board dimensions, ground clearance, enclosure material, battery position and cable routing all affect RF performance. Our portfolio covers on-board and off-board embedded antenna formats for cellular and GPS/GNSS applications, with custom cable, connector and tuning support for OEM projects.

Explore Global RF Tech

Embedded antenna types

Cellular

Patch antennas

Wideband internal antennas for routers, gateways and IoT terminals.

Embedded cellular patch antenna
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Flexible integration

FPC & PCB antennas

Thin adhesive or printed formats for compact plastic enclosures.

Flexible and PCB antenna for embedded wireless devices
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Positioning

Ceramic GPS/GNSS

Active and passive ceramic patch antennas for satellite positioning.

Ceramic GPS GNSS patch antenna
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Selection guide

Chip vs PCB vs ceramic

Compare size, efficiency, ground-plane needs, manufacturing cost and integration risk before choosing an embedded antenna.

Read the guide

Featured embedded antennas

Start with a proven antenna format

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GL-DY108 embedded cellular patch antenna

Cellular patch

GL-DY108

700–960 / 1710–2700 MHz embedded antenna for cellular routers and IoT gateways.

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GL-DY131 IPEX embedded cellular patch antenna

Cellular patch with IPEX

GL-DY131

698–960 / 1710–2690 MHz internal antenna with cable and IPEX connector.

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GL-DYS25 ceramic GPS GNSS patch antenna series

GPS/GNSS ceramic patch

GL-DYS25 Series

Active and passive RHCP patch options for GPS, GLONASS, Galileo and BeiDou.

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Embedded antenna integration inside a wireless device enclosure

Integration support

GNSS integration

Need help choosing a GNSS or patch antenna?

Tell us your device size, ground plane, constellation, cable and mounting requirements. We can help match active, passive or embedded GNSS antenna options.

The enclosure is part of the RF design

Datasheet performance assumes a defined test board and antenna clearance. The final device can shift resonance and reduce efficiency, so integration should be checked in the assembled enclosure.

  • Ground plane: confirm dimensions and the antenna reference layout.
  • Keep-out area: separate the antenna from batteries, shields and displays.
  • Enclosure: evaluate plastic, coatings, metal hardware and cable routing.
  • Final tuning: verify matching, efficiency and radiation pattern before certification.

Discuss your project →

Embedded antenna FAQ

Questions engineers ask before selection

What is an embedded antenna?

An embedded or internal antenna is installed inside the host product as a chip, PCB element, FPC antenna or ceramic patch instead of being mounted outside the enclosure.

Chip, PCB, FPC or ceramic patch—which should I use?

Choose a chip antenna for a small component footprint, PCB for an integrated printed design, FPC for flexible placement, and ceramic patch for sky-facing GPS/GNSS positioning.

Why does an internal antenna underperform its datasheet?

The final ground plane, enclosure, battery, display, cable and nearby metal change antenna impedance and efficiency. Test and tune the complete assembled device.

What information should I send for a recommendation?

Send the target bands, board dimensions, ground area, enclosure material, available antenna space, connector or cable requirements and certification market.

OEM / ODM antenna support

Need an embedded antenna matched to your device?

Send the bands, PCB dimensions, ground area and enclosure drawing. We can recommend a starting antenna and discuss connector, cable and tuning requirements.

Request samples or a quote →

PCB trace antenna design basics

Use our PCB antenna guide to compare printed traces with ceramic chip and FPC architectures before layout release.

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